Dicing Saw is a saw that
is used to dice, groove, or cut semiconductor wafers by using a
high-speed spindle that has been fitted with a diamond blade. A dicing
saw is a part of a dicing machine, which cuts these wafers into
individual chips. Some of the materials that can be diced using this
machine are silicon, silicon carbide, gallium nitride, gallium arsenide,
ceramic, sapphire, and glass. Dicing blades of varying thickness are
used to saw the wafers based on the material being sawed. Dicing
equipment can be categorized into three types, namely sawing equipment,
scribing equipment, and sawing accessories. Sawing accessories consist
of breaking, mounting, and surface grinding.
The Global Wafer Dicing Saws Market to grow at a CAGR of 6.35% during the period 2017-2021.
Covered in this report
The report covers the present scenario
and the growth prospects of the global wafer dicing saws market for
2017-2021. To calculate the market size, the report considers the
revenues from major wafer dicing saws vendors..
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Global Wafer Dicing Saws Market
2017-2021, has been prepared based on an in-depth market analysis with
inputs from industry experts. The report covers the market landscape and
its growth prospects over the coming years. The report also includes a
discussion of the key vendors operating in this market.
Key vendors
• DISCO Corporation
• TOKYO SEIMITSU
• Advanced Dicing Technology
• Dynatex International
Market driver
• Growing demand for IoT
• For a full, detailed list, view our report
Market challenge
• Volatile nature of the semiconductor industry
• For a full, detailed list, view our report
Market trend
• Growth of AI
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
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analyst’s time when you purchase this market report. Details are
provided within the report.
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